New Taipei City, Taiwan
Direct bench-level engineering and turnkey PCBA execution
0201
fine-pitch passives capability
IPC-A-610
Class 2 & 3 compliance
48 hrs
rapid prototyping turnaround
Production Thresholds
16-Layer
multilayer PCB assembly depth
99.4%
automated optical inspection yield
±0.01mm
SMT placement precision
100%
audited Taiwan component supply lines
Engineering Discipline
We evaluate every project at the schematic level before quoting production lead times.
Component integrity is measured, tested, and documented from surface-mount prototypes to pilot production runs.
Production Streams
Core engineering execution
Embedded Firmware Integration
Turnkey SMT Prototyping
Microcontroller programming and functional testing executed directly on the assembly floor by our bench engineers.
Rapid surface-mount technology assembly optimized for tight iteration cycles, complete with real-time BOM validation.
Pilot & Box-Build Assembly
Scalable production runs adhering strictly to IPC-A-610 standards with full traceability on every sub-assembly.
Send your Gerber files and BOM spreadsheets directly to our New Taipei City production desk.